| 发明名称 |
Electrodeposition of copper |
| 摘要 |
This invention relates to a process and to novel compositions for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member from each of the following two groups:
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| 申请公布号 |
US4009087(A) |
申请公布日期 |
1977.02.22 |
| 申请号 |
US19750644350 |
申请日期 |
1975.12.24 |
| 申请人 |
M&T CHEMICALS INC. |
发明人 |
KARDOS, OTTO;ARCILESI, DONALD A.;VALAYIL, SILVESTER P. |
| 分类号 |
C25D3/38;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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