发明名称 DIE AND METHOD FOR CUTTING LABELS AND THE LIKE
摘要 <p>A die is provided for cutting at least one but less than all of the layers of a plurality of layers of paper such as a sheet of lables or the like. A raised cutting edge of the die is rounded so that the portions of the cut layer or layers on either side of a cut made by the cutting edge are cammed away from each other so that the backing or other layers are neither cut nor crushed. The die may be made by etching according to conventional procedures followed by moving the usual cutting edge obtained through a spray of etching fluid at such a rate that the cutting edge is naturally rounded.</p>
申请公布号 CA1005750(A) 申请公布日期 1977.02.22
申请号 CA19730178869 申请日期 1973.08.15
申请人 CHEMPAR CORPORATION 发明人 KANG, PIERSON S.
分类号 B65C9/18;B26D3/08;B31B1/20;B31D1/02;B65C1/00;G09F3/00 主分类号 B65C9/18
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