| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonder which forms a bump by bonding a ball formed at the front end of a wire to the electrode of an IC chip, and can secure high productivity when the number of bumps on each IC chip is small. SOLUTION: Openings 7 which are engaged with the side edges of IC chips 11 arranged in a bump bonder are formed at regular pitch intervals, and a carrying means 1 having an endless belt 5 which is intermittently driven on a stage 2 constituting a carrying route at the above-mentioned regular pitch is provided. On one end side of the carrying means 1, a supplying and transferring means 13 supplies the IC chips 11 into the openings 7 and, at a prescribed position in the middle of the carrying means 1, a bonding head 21 forms bumps on the electrodes of the chips 17 housed in the openings 7. On the other end side of the carrying means 1, in addition, a taking-out and transferring means 17 takes out the chips 11 from the openings 7. |
