| 摘要 |
A plurality of profiled elements is coated with protective layers whose thickness corresponds to one-half of the desired width of the slots of a sieve to be assembled from such elements. These elements are juxtaposed on a support having the general shape of the sieve to be obtained so that the protective layers of any two adjacent elements abut each other, and secured to the support. Portions of the protective layers are removed in the regions of intended junctions and the elements are interconnected by electroplating, welding or glueing, thus forming a self-supporting sieve body. The remaining portions of the protective layers are removed to form voids between the elements to subsequently serve as sieve slots, with concurrent or preceding removal of the support. |
