| 摘要 |
PURPOSE:To reduce a danger of damage, electrostatic breakdown, etc., by depressing a terminal for externally leading the line of a semiconductor device in a package. CONSTITUTION:Metal leads 7, 8 are buried in a board 4, the inner ends of the leads 7, 8 are exposed within a package 2, the inner end of the lead 7 is connected to a signal line of a semiconductor device 1 through a wire 6a, and the inner end of the lead 8 is connected to a ground line of the device 1 through a wire 6b. Metal bottomed cylindrical recesses 9, 10 opened at the lower surface of the board 4 are buried in the recess 4 in such a manner that the recess 9 is brought into contact with the outer end of the lead 7 and the recess 10 is brought into contact with the outer end of the lead 7. Here, the recesses 9, 10 form terminals. A metal ground layer 11 is provided on the lower surface of the board 4, the opening end of the recess 10 is brought into contact with the layer 11, and the recess 9 is not brought into contact with the layer 11 by a ringlike insulator 12. |
