| 摘要 |
<p>1487243 Electroless plating OXY METAL INDUSTRIES CORP 23 Sept 1974 [21 September 1973] 41255/74 Heading C7F A plastics substrate, e.g. polypropylene, phenolic, epoxy, polysulphone, A.B.S., is plated with e.g. Cu, Co or Ni by etching the surface in acid, activating with a Sn-Pd complex, rinsing with water, and then accelerating with a solution comprising hydrochloric, sulphuric or fluoroboric acid, a compound capable of forming fluoride ions, and a salt (chloride) of Ni, Co, Pd, Ru, Rh, Os, Ir or Pt. Fluorides of Na, K, Li, NH 4 , acid fluorides of K, Na or NH 4 , HF or fluorosilicic acid may be used.</p> |
