| 摘要 |
Copper parts associated with thermal compression bonding of lead structures to a semiconductive device, such as the lead frame, the interconnect lead, and the gang bonding bumps, are coated with an antioxidant material. The antioxidant material and its thickness are chosen to be compatible with thermal compression bonding therethrough so that the completed thermal compression bond forms a bonding interface to the copper through the antioxidant coating. Suitable antioxidant coating materials include, gold, chromate, and copper phosphate. |
