发明名称 |
Apparatus for bonding and plating with exploding foil |
摘要 |
Bonds are made between two work pieces by using foils exploded by electrical energy typically stored in a large capacitor. To increase the uniformity of the bond area, a foil having at least one slit cut in the direction of current flow is used. The foil strips separated by the slit are attracted together by the pinch effect when current is applied, tending to eliminate loss of foil through a jetting action during explosion. Platings are made by pressing the foil between the work piece and a plastic layer to which the foil does not adhere. In both bonding and plating, the capacitor is charged with energy sufficient to bring the foil just to its boiling point. This "tuning" is more efficient and minimizes heat and blast effects that might otherwise damage a small work piece.
|
申请公布号 |
US4008117(A) |
申请公布日期 |
1977.02.15 |
申请号 |
US19750551774 |
申请日期 |
1975.02.21 |
申请人 |
BELL TELEPHONE LABORATORIES, INCORPORATED |
发明人 |
DYBWAD, GAY LEON |
分类号 |
B23K11/26;B23K20/06;C23C14/32;H05K3/02;H05K3/38;(IPC1-7):B23K11/26;C03C27/08;C23C13/08 |
主分类号 |
B23K11/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|