发明名称 Fluxless soldering of aluminium using crimped joints - where crimping deformation breaks up oxide film on molten solder
摘要 <p>The mating surfaces are coated with a film of solder, and then a heated froming device is employed to apply press. on the segments melting the solder and reducing its thickness to a min., together with deformation of the segments and their relative movement wrt the solder. The oxide film on the solder is ruptured and does not form a continuous layer; a good soldered joint is thud obtd. The wall segments are pref. Al, and the heat and pressure is pref. applied for 2-6 seconds esp. using a press. of >=35 kg/cm2. Used for soldered joints employed in heat exchangers.</p>
申请公布号 FR2317993(A1) 申请公布日期 1977.02.11
申请号 FR19760021593 申请日期 1976.07.15
申请人 GENERAL ELECTRIC CY 发明人 GERALD JOSEPH KUSHNER ET JOHN HENRY NININGER III;NININGER JOHN HENRY III
分类号 B23K20/00;B23K1/00;B23K1/18;B23K1/19;(IPC1-7):23K1/00 主分类号 B23K20/00
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