发明名称 |
Fluxless soldering of aluminium using crimped joints - where crimping deformation breaks up oxide film on molten solder |
摘要 |
<p>The mating surfaces are coated with a film of solder, and then a heated froming device is employed to apply press. on the segments melting the solder and reducing its thickness to a min., together with deformation of the segments and their relative movement wrt the solder. The oxide film on the solder is ruptured and does not form a continuous layer; a good soldered joint is thud obtd. The wall segments are pref. Al, and the heat and pressure is pref. applied for 2-6 seconds esp. using a press. of >=35 kg/cm2. Used for soldered joints employed in heat exchangers.</p> |
申请公布号 |
FR2317993(A1) |
申请公布日期 |
1977.02.11 |
申请号 |
FR19760021593 |
申请日期 |
1976.07.15 |
申请人 |
GENERAL ELECTRIC CY |
发明人 |
GERALD JOSEPH KUSHNER ET JOHN HENRY NININGER III;NININGER JOHN HENRY III |
分类号 |
B23K20/00;B23K1/00;B23K1/18;B23K1/19;(IPC1-7):23K1/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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