发明名称 Method for forming a metal plug
摘要 A method for forming a metal plug is provided. The method is used to form a metal plug without a hole on a glue/barrier layer within a trench when the glue/barrier layer has been formed for a while. A substrate with a trench therein and a glue/barrier layer formed conformal to the profile of the substrate is provided. A post-treatment is performed on the glue/barrier layer to prevent moisture absorption and to make the glue/barrier become dense. The post-treatment comprises a plasma treatment or a deep UV plus laser treatment. After performing the post-treatment step, a metal layer is formed on the glue/barrier layer at least to fill in the trench. The metal layer other than that filling the trench is removed to form a metal plug.
申请公布号 US6150259(A) 申请公布日期 2000.11.21
申请号 US19980191162 申请日期 1998.11.13
申请人 UNITED MICROELECTRONICS CORP. 发明人 WU, KUN-LIN;LU, HORNG-BOR
分类号 H01L21/768;(IPC1-7):H01L21/476 主分类号 H01L21/768
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