| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR PELLETS |
| 摘要 |
<p>PURPOSE:To perform a high accuracy wafer cutting operation by cutting while spurting an etching solution mixed with grains.</p> |
| 申请公布号 |
JPS5215269(A) |
申请公布日期 |
1977.02.04 |
| 申请号 |
JP19750091393 |
申请日期 |
1975.07.26 |
| 申请人 |
FUJI ELECTRIC CO LTD |
发明人 |
OKAZAKI TATSUROU |
| 分类号 |
H01L21/301;H01L21/302;H01L21/306 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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