发明名称 HEAT SINK, SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER MODULE, AND RAMAN AMPLIFIER
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor laser device for efficiently radiating heat that is generated from a semiconductor laser element by improving the shape of a heat sink for installing the semiconductor laser element, and to provide a semiconductor laser module and a Raman amplifier. SOLUTION: Inclined sections 5a and 5b that are inclined toward the bottom surface are formed at least at either side of the side of a first optical system 3, and the side of a second optical system 4 from the end section of a location for installing the semiconductor laser element on a top surface 2a of the heat sink 2 for installing the semiconductor laser element 1, thus expanding the radiation region of the heat sink 2 as compared with before without shielding the optical path of a laser beam being emitted from the semiconductor laser element 1 and without coming into contact with the first optical system 3 and the second optical system 4, and hence increasing the optical output of the semiconductor laser module. Therefore, even if high output is requested as in the excitation light source of Raman amplification, the semiconductor laser module can be applied.</p>
申请公布号 JP2002204020(A) 申请公布日期 2002.07.19
申请号 JP20010316118 申请日期 2001.10.12
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KANAMARU SADAYOSHI;KIMURA TOSHIO
分类号 G02B6/42;G02F1/35;H01S5/022;(IPC1-7):H01S5/022 主分类号 G02B6/42
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