LOW PROFILE MOLDING COMPOSITION

摘要

Better wet-out of glass fiber, lower viscosity of the resin mix which allows for higher filler loadings and better stability are the improvements of this invention. The compositions are prepared by an improved process which comprises mixing a vinyl ester resin having pendant half ester groups and a copolymerizable monomer with a polymeric low profile additive, glass fiber reinforcing material, CaCO3 filler and a viscosity reducing agent comprising a copolymer of a maleic acid half ester of a polyethylene glycol having a molecular weight of about 1450 to 6000 and a monoalkenyl aromatic monomer. A chemical thickening agent such as magnesium oxide may also be added.