| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of laminated ceramic electronic components for reducing the time required for cutting, manufacturing costs, and the unit cost of the components. SOLUTION: The laminated ceramic capacitor is manufactured by a process (a) for forming a green sheet, a process (b) for forming a conductor layer for internal electrodes, a lamination process (c), a contact bonding process (d), a heat-treatment process (k1), a cutting process (e), a polishing process (f), a debinder process (g), a process (h) for forming a conductive layer for external electrodes, a sintering process (i), and a plating process (j) in this order. In the heat treatment process (k1), a laminated green sheet after contact bonding is heat-treated for specific time at specific temperature that is lower tan the sintering temperature, thus eliminating one portion of the binder in the lamination green sheet. In the lamination green sheet that ahs been subjected to the heat treatment process (k1), one portion of the binder that exists between dielectric material powder is removed, porosity is increased, and the viscosity of the sheet itself is decreased for increasing hardness, thus easily cutting the laminated green sheet with blades such as rotary and elevation blades. |
