| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem of exfoliation being generated in the interface between a lead part and a sealing resin, in the manufacture of a multiple LGA- type resin-sealed semiconductor device, and of the reliability of the semiconductor device being lowered. SOLUTION: The lead frame is provided with first lead parts 14, which face a die pad part 12 inside the opening region of a frame body 11 and which comprise first bonding pad parts 14a and first land parts 14b, second lead parts 15 which comprise second bonding pad parts 15a and second land parts 15b and third lead parts 16 which comprise third bonding pad parts 16a and third land parts 16b. The parts 15 comprise thin-width constriction parts 17. Each bonding pad part comprises an upward protruding step part 18. Thereby, when stress is applied to the lead parts in the manufacturing process of the resin- sealed semiconductor device and even if exfoliation is generated in the interface between each lead part and the sealing resin, exfoliation which is progressing can be stopped.</p> |
