| 摘要 |
<p>The present invention relates to a mounting apparatus (40) for mounting an electronic part (3) utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system, comprising an ultrasonic vibration generating device (8), a horn (7) attached to the ultrasonic vibration generating device (8), a collet tool (6) for holding an electronic part (3) attached to the horn (7), a control unit (9) being connected to the ultrasonic vibration generating device (8), and a substrate conductor heating unit (4) connected to said control unit (9). To inspect the state of the formed joint a measuring device for monitoring a voltage, an electric current, or both to be applied to the ultrasonic vibration generating device (8) is connected with the control unit (9). Thus, it is possible to measure a voltage and/or an electric current (i) applied to the ultrasonic vibration generating device (9), to respectively compare the measured voltage and/or electric current (i) with reference wave forms to determine whether the voltage and/or electric current are applied normally to the ultrasonic vibrating generating device (9) and to judge the formed connection defective or non-defective in accordance with the results of the comparison of the measured voltage and/or electric current with reference wave forms. <IMAGE></p> |
