| 摘要 |
PURPOSE:To improve processing efficiency by constituting the laser processing device in such a manner thant the deviation in the focal position of a laser beam by the warpage generated in a work is corrected to execute processing. CONSTITUTION:The laser processing device for a semiconductor wafer 1 as the work held on a holder 15 is constituted of a 1st driving mechanism 21 in the X- and Y-directions of the holder 15, a laser oscillator 11, an optical system 14 for focusing and projecting the laser beam to the work 1, a 2nd driving mechanism 28 for changing the focal position of the laser beam, a work height detector 29, and a control section 31 which detects and computes the height over the entire area on the front surface of the work and controls the 2nd driving mechanism. The laser processing of the warped work 1 by maintaining the specified focal position with respect to the work is executed in this way and the efficiency is improved. |
