| 摘要 |
Provided is a substrate processing method by which a water mark is prevented from being generated on a substrate at a low cost. At the time of processing the substrate by using a chemical, humidity at the periphery of the substrate is adjusted corresponding to the type of the chemical. The humidity is adjusted at least in a drying process for drying the substrate (W). In one example, the humidity at the periphery of the substrate is adjusted at the time of supplying the substrate (W) with a fluid including IPA, i.e., a drying fluid, after processing the substrate (W) by using the chemical. |
