| 摘要 |
<p>PURPOSE:To reduce man-hours and to manufacture a highly reliable chip resistor by providing the top face of a substrate with a pair of gold top electrodes, a resistor film, a pair of silver side electrodes, and a passivation film which covers the top faces of the electrodes and the resistor film and the top electrodes. CONSTITUTION:The top face of a ceramic substrate 8 is provided with top electrodes so that they may not reach the end of the substrate, but correspond to longitudinal both ends, and with the side and bottom electrodes 3. Further, this substrate 8 is provided with a resistor 2 between the top electrodes 1: this resistor 2 is covered with a passivation film 4 together with the whole top electrodes 1 as well as a part of the side electrodes 3. Since the electrode 1 contacting the resistor 2 is a gold electrode, high reliability can be obtained; whereas since a silver-palladium electrode 3 contacting this gold electrode 1 is a microchip, it can be formed simultaneously with printing of the side elec trode 3. This can reduce man-hours by keeping reliability.</p> |
