Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board

摘要

An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer.

主权项

1. An electronic component, comprising:
an insulation layer comprising an optically transparent resin material; a conductive layer formed on a first surface of the insulation layer and patterned such that the conductive layer comprises an alignment mark and a wiring layer formed on the first surface of the insulation layer; and an adhesive layer comprising an adhesive resin material and an optically opaque agent and formed on a second surface of the insulation layer on an opposite side with respect to the first surface of the insulation layer, wherein the adhesive layer has an opening portion formed at a position corresponding to the alignment mark such that the opening portion exposes the alignment mark through the insulation layer.