| 摘要 |
PURPOSE:To uniformly treat the whole area of the surface of a wafer with a chemical liquid by vertically moving a wafer holding mechanism such as a vacuum section arm for holding the wafer horizontally to the surface of the chemical liquid, and subjecting the wafer to vibration by use of a vibrating mechanism connected to the holding mechanism during the chemical treatment. CONSTITUTION:A wafer 1 is held at the surface to be developed by a wafer holding mechanism formed of a vacuum chuck 2 horizontal to the surface of developer 6 and a vacuum suction arm 3. The surface to be treated of the wafer 1 is brought into contact with developer 6 by an arm operating mecha nism (moving mechanism). An ultrasonic vibrator 5 vibrates the wafer 1 as a vibrating mechanism connected to the arm 3 during developing. Thus, develop ing reaction is uniformly executed on the surface of the wafer. |
