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发明名称
HIGH SPEED PACKAGING OF MINIATURIZED CIRCUIT MODULES
摘要
申请公布号
CA777853(A)
申请公布日期
1968.02.06
申请号
CAD777853
申请日期
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
REIJO A. RINNE;LEONARD J. POCH;WILLIAM G. SWEENEY;WILLIAM K. SPRINGFIELD;BERT E. STEVENS
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