| 摘要 |
In one embodiment this invention provides novel thermosetting aromatic polyimide prepolymers which have superior solubility and flow properties, and which can be thermally cured to heat and oxidation resistant thermoset adhesives, films, and molded products. Illustrative of a prepolymer is the dimaleimide of 2,2-bis[p,p'-(m-aminophenoxy)phenylsulfonyl(p-phenyleneoxy)-phenyl]pro pane.
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