| 摘要 |
<p>PURPOSE:To enable sucking and fixing with a little amount of pressing-down and prevent adverse influence upon the post-process of dicing, by forming a dicing table to be a circular truncated cone, arranging vacuum grooves on the whole surface, and installing a frame sucking part around the bottom part. CONSTITUTION:A dicing table (vacuum chuck) 1 is formed to be a hollow circular truncated cone, and vacuum grooves 4 of concentric circles are formed on the whole surface of an upper surface part 2 and a taper part 3. A semiconductor wafer is positioned on the upper surface part 2. A sucking part 6 is arranged around the bottom part 5 of the circular truncated cone. Vacuum lines 7 are provided on the upper surface part 2 and the sucking part 6, and connected with a vacuum via a vacuum pipe 8. On the inner side 5a of the bottom part 5, a narrow groove is formed between the vacuum lines 7, and connected with a drain 9 for discharging water, via a solenoid valve from the vacuum line 7. On the other hand, a water discharging groove 10 as the drainage conduit is arranged at a specified portion on the outer side 5b of the bottom part 5.</p> |
