| 摘要 |
<p>There are disclosed (1) an injection-molded thermoplastic resin article having on a surface thereof a copper foil or a copper foil circuit, wherein the thermoplastic resin comprises one of polycarbonate, polyethersulfone, and polyetherimide and an adhesive layer comprising polyvinyl butyral having a degree of polymerization of up to 1000, polyvinyl formal having a degree of polymerization of up to 1000, or a mixture of both polymers is formed either the copper foil or the copper foil circuit and the molded thermoplastic resin and (2) a process for producing such injection-molded thermoplastic resin articles.</p> |
