Apparatus for placing several solder balls onto a substrate

摘要

The apparatus for placing several solder balls onto a substrate incorporates a solder ball holding element (10) which channels (12) whose diameter is smaller than the diameter of the solder balls to be held. It further incorporates optical fibres (22) and an element (16) for holding them. This element is positioned so that the fibres are oriented in the direction of the respective channels in the ball holding element. The chamber (18) formed between the elements (10) and (16) can be put under a reduced pressure. The method consists of picking up and holding of solder balls as a result of reduced pressure in the chamber (18), positioning and release of them on a substrate, and melting of them by means of laser pulses through the channels (12).