发明名称 EVALUATING METHOD AND EVALUATING DEVICE FOR PHOTORESIST FILM
摘要 PURPOSE:To evaluate the performance of a photoresist film corresponding to the deformation in the cut surface shape of the non-dissolved part of the photoresist film by observing the cut surface shape of the non-dissolved part. CONSTITUTION:A substrate with the photoresist film subjected to image exposing is cut in the direction perpendicular to the substrate plane to obtain a leaf 10. The leaf 10 is placed under a microscope in such a manner that the cut face thereof can be observed. A developing soln. passed through a developing soln. injecting device 6 and a developing soln. supplying pipe 4 is brought into contact with the photoresist film side of the leaf 10 and while the soluble part of the photoresist film is dissolved, the cut surface shape of the non-dissolved part of the film is observed. The performance of the photoresist film corresponding to the deformation of the cut surface shape of the non-dissolved part is evaluated. The change in the state during the development of the photoresist film subjected to the image exposing is continuously observed in detail in this way.
申请公布号 JPH03253578(A) 申请公布日期 1991.11.12
申请号 JP19900048784 申请日期 1990.02.28
申请人 FUJI PHOTO FILM CO LTD 发明人 TANIGAMI SHUNZO
分类号 G01B21/20;C23F1/00;G03F7/26;H05K3/06 主分类号 G01B21/20
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