| 摘要 |
A method and device for forecasting the polishing end point is provided to perform the polishing for the polishing time which is calculated after detecting the critical change and to polish the conductive film. The polishing device(1) is comprised of the platen(2) and polishing head(3). The axis of rotation(4) is connected to the center of lower face of platen. The polishing pad(6) is adhered in the upper side of platen. The device(33) for forecasting the polishing end point is formed on the top of platen. The slip ring(32) outputs the detection signal of the critical change from the device for forecasting the polishing end point to outside. The inductor(36) is comprised of the meander type.
|
