发明名称 |
MICROELECTRONIC CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a microelectronic contact structure and a manufacturing method for manufacturing the microelectronic contact structure. <P>SOLUTION: The method for mounting a plurality of spring contact elements to the terminal of an electronic component includes the manufacture of a plurality of spring contact elements on a sacrifice substrate, mounting one portion of the spring contact elements to the terminal of electronic components while the spring contact element is on the sacrifice substrate, and the removal of the sacrifice substrate after one portion of the spring contact element is mounted to the terminal of the electronic components. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008046139(A) |
申请公布日期 |
2008.02.28 |
申请号 |
JP20070244529 |
申请日期 |
2007.09.20 |
申请人 |
FORMFACTOR INC |
发明人 |
KHANDROS IGOR Y;ELDRIDGE BENJAMIN N;MATHIEU GAETAN L;GARY W GRUBE |
分类号 |
G01R1/067;G01R1/073;G01R3/00;G01R31/28;G01R31/316;H01H1/00;H01L21/66;H01L23/48;H01L23/485;H01L23/498;H01R13/24;H05K3/20;H05K3/34 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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