发明名称 In-mold decorating method and in-mold system
摘要 A case molded article is molded by injecting resin into a molding space formed in an in-mold decoration die; meanwhile, foil is joined to the surface of the case molded article. After that, the foil is peeled off from the surface of the case molded article while leaving a pattern layer at least on the upper ends of the corners of the rising wall on the case molded article. Subsequently, the foil is peeled off from the surface of the case molded article while leaving the pattern layer at other points where the foil is joined to the surface of the case molded article.
申请公布号 US9370885(B2) 申请公布日期 2016.06.21
申请号 US201313921853 申请日期 2013.06.19
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 Nishitani Kenji;Kurisu Masahumi;Miyazaki Masamitsu;Ezaki Akira;Pei Guangri
分类号 B29C45/00;B29C45/33;B29C45/14;B29C45/44;B29C45/40 主分类号 B29C45/00
代理机构 Hamre, Schumann, Mueller & Larson, P.C. 代理人 Hamre, Schumann, Mueller & Larson, P.C.
主权项 1. An in-mold decorating method comprising: a first step of joining foil to a surface of a case molded article while molding the case molded article by injecting resin into a molding space formed in an in-mold decoration die; a second step of peeling the foil from the surface of the case molded article while leaving a pattern layer at least on upper ends of corners of a rising wall on the case molded article, wherein in the second step, a first push pin presses the foil to a divided surface of a first slide core while the first slide core assembled to the in-mold decoration die retracts, the first slide core forming a surface of the corner into a predetermined shape; and a third step of peeling the foil from the surface of the case molded article while leaving the pattern layer at points other than points where the foil is peeled off in the second step.
地址 Osaka JP