| 摘要 |
PURPOSE:To reduce the oxide films on metalic surfaces so as to make up the weak activation power of a flux by interposing a board preheating zone having a board pooling mechanism to lift and bypass printed boards upward or downward between a transporting body for carrying in and a transporting body for carrying out. CONSTITUTION:A cylinder 15 detects the arrivals of the printed board at the carrying out end of the transporting body 5 for carrying in by means of a sensor and stops the transporting body 5 for carrying in by this detection signal. The printed board in the stop state is transferred and supported between the supporting plates of the upward transporting body 13 in this way. A cylinder 16 transfers the printed board arriving at the uppermost stage of the upward transporting body 13 to the spacing between the supporting plates of the uppermost stage of the downward transporting body 14. A cylinder 17 transfers the printed circuit board arriving at the lowermost stage of the downward transporting body 14 onto the transporting body 7 for carrying out. The preheating time is rationally prolonged in this way to reduce the oxide films of the metallic surfaces, by which the weak activation power of the flux is made up and the soldering operation without washing is effectively executed. |
