| 摘要 |
PURPOSE:To enable a required fine pattern to be easily formed by a method wherein a solder resist film pattern is deposited on a laminated board which is formed by laminating base materials into one piece, and a chemical plating layer is deposited on a prescribed circuit pattern region. CONSTITUTION:A copper foil is plated on the primary surface of, for instance, a prepreg layer where resin deposited by dipping is semi-cured or partially uncured to form a base board 7, a required through-hole 4 is bored in the board 7, and a photoetching treatment is carried out to form a required circuit pattern 1 on the board 7. The base board 7 is cured into one piece by thermocompression forming to enable the circuit pattern 1 to be buried in the surface of the base board 7, consequently a laminated board 3' whose surface is flattened can be obtained, and a required solder resist film pattern 2 is selectively formed on the surface of the laminated board 3'. The laminated board 3' is subjected to a chemical copper plating treatment, whereby a chemical plating layer 5 is deposited on circuit pattern regions 1a and 4a not covered with the solder resist film 2 to form a required printed wiring board 3. By this setup, a fine patterning can be carried out. |
