| 摘要 |
PURPOSE:To dispense with a frame mounting process by a method wherein a solid-state image sensing element connected to a wiring pattern formed of conductive film is mounted in a recess provided to a metal-core board, where the photodetective face of the image sensing device is located lower than the flat part of the metal-core board, and a light transmissive lid is provided to seal up the recess concerned. CONSTITUTION:A metal-core board 10 is formed in such a structure that an insulating film 12 is formed on both the sides of a metal base board 101, and a copper foil 103 and a resist film 104 are deposited thereon. A plate shaped recess 11 is provided to a prescribed position on the metal core board 10 through a press forming method. The recess 11 is formed so deep as to enable a photodetective face 21 of a solid-state image sensing element 20 to be located lower than a flat part 12 of the metal core board 10. The bonding pad of the solid-state image sensing device 20 is connected to a bonding terminal with a bonding wire of Au or Al. A light transmitting lid 30 formed of glass or synthetic resin is bonded to the flat part 12 located at the peripheral part of the recess 11 with an adhesive agent 43 of epoxy resin or the like to seal up the recess 11. |
