发明名称 Verfahren zum Erhoehen der Haftung von Polymeren auf Metallen
摘要 1,271,352. Printed circuits. INTERNATIONAL BUSINESS MACHINES CORP. 12 Jan., 1970 [14 Jan., 1969], No. 1362/70. Heading H1R. A pattern of closely spaced conducting lines 0À001 inch or less in width is produced by depositing a continuous thin film of metal on a substrate, treating the exposed metal surface with a solution of a co-ordination compound of Cr and a carboxylic acid in a suitable solvent and drying, applying a photoresist layer, exposing and developing to yield an etch-resistant mask corresponding to the desired conducting pattern, and then etching away the unprotected portions of metal. The substrate may be Si, the metal Cu, Mo, Ni, Fe, Au, Mg, Pt, Ag, steel, Ti, Zn, or alloys thereof, or preferably, vacuumdeposited aluminium; the preferred chromium compound is a complex of CrX 2 (X = Halogen) with a 2-30 C atom carboxylic acid, e.g. an olefinic carboxylic acid, a C 10 -C 20 fatty acid, or a C 7 -C 20 aromatic carboxylic acid (a list is given), and the most preferred complex is methacrylato chromic chloride. A 0À02-7 wt. per cent solution of the complex in isopropanol, water, or acetone may be applied to the metal surface at room temperature; it is believed that the Cr atoms form a bond with the metal surface and the carboxylic acid part of the compound bonds to the subsequently applied polymer resist, which may be a vinyl, acrylic, alkyd, urethane or epoxy resin.
申请公布号 DE2001548(A1) 申请公布日期 1970.07.23
申请号 DE19702001548 申请日期 1970.01.14
申请人 INTERNATIONAL BUSINESS MACHINES CORP. 发明人 ARTHUR COUTURE,ROGER;JAMES LAJZA,JUN.,JOHN;ELLWOOD WRIGHT,WILLIAM
分类号 C23C22/00;G03F7/11 主分类号 C23C22/00
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