A CARRIER FOR A PLURALITY OF ELECTRICAL OR ELECTRONIC COMPONENTS

摘要

A carrier for holding SOIC packages during the application of solder to their leads comprises a frame including an end plate (17) with mounting lugs (20). On each lug is mounted an upper "U"shaped member (1) and a lower "U" shaped eleongate member (8), with their legs (3) and (10) respectively projecting downwards. The legs (10) are within the legs (3) but extend further and are turned outwards at the ends (11). Between each such assembly is defined a track (T) for a line of SOIC packages (24) whose leads (26) rest on end portions (11) and which are restricted against upwards motion by the ends (4) of legs (3).