| 摘要 |
PURPOSE:To prevent the deformation of a wafer supporting tool and to contrive the simplification of a process and the reduction of time by a method wherein the exfoliation of a film by low-temperature cooling is utilized. CONSTITUTION:A wafer supporting tool 1 adhered a growth film 2 is firstly cooled to room temperature. Next, the wafer supporting tool 1 arrived at the room temperature is further cooled in liquid nitrogen or at the temperature corresponding to the liquid nitrogen, then the exfoliation of a growth film 2a is followed. Then, the exfoliated growth film 2a is mechanically and completely eliminated by a blush or the blast of nitrogen gas. After that, the temperature of the wafer supporting tool 1 is gradually returned to room temperature from a low temperature. |
