发明名称 |
Bonding method |
摘要 |
A method for bonding which comprises: interposing between the articles to be bonded at least one of which has an aqueous moisture content in a normal condition of at least about 1% by weight based on the weight of the article, a moisture curable adhesive material and then heating the assembly under pressure to supply water vapor from the moisture-containing article to cure the adhesive material, wherein said adhesive material comprises a sheet, film or tape of a thermofusible adhesive resin and/or rubber containing about 0.1 to 20% by weight based on the weight of the resin and/or rubber of a carboxyl group and not more than about 0.5% by weight free water and uniformly dispersed therein, a powder of an oxide of a metal of Group IIa of Mendeleev's Periodic Table having an average particle diameter of about 0.1 to 1,000 mu .
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申请公布号 |
US4453997(A) |
申请公布日期 |
1984.06.12 |
申请号 |
US19830468807 |
申请日期 |
1983.02.28 |
申请人 |
NITTO ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HORI, YUTAKA;SUNAKAWA, MAKOTO;SATSUMA, MICHIO |
分类号 |
C09J5/00;C09J5/06;C09J7/00;C09J11/04;(IPC1-7):C09J5/00;B05D5/10;B65C9/25 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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