| 摘要 |
<p>PURPOSE:To provide a photo-curable, developable liquid solder-resist ink compsn. which gives a cured coating film having excellent adhesion, resistance to solvents and heat, etc., consisting of an energetic ray-curable resin, a photopolymerization initiator and an org. solvent. CONSTITUTION:A reaction product (a) between a novolak type epoxy compd. and an unsaturated monocarboxylic acid is reacted with a reaction product (b) between a diisocyanate and a polyfunctional hydroxyl group-contg. poly(meth) acrylate contg. one hydroxyl group and at least two (meth)acryloyloxy groups per molecule to obtain an energetic ray-curable resin (A) having a softening point of 20-120 deg.C, contg. an average of at least 5 ethylenically unsaturated bonds per molecule and having a novolak resin skeleton. 100pts.wt. component A, 0.2-30pts.wt. photopolymerization initiator (e.g. benzoin isopropyl ether) and 30-300pts.wt. org. solvent (e.g. butyl cellosolve) are blended together.</p> |
