| 发明名称 |
CLOSED LOOP LIQUID COOLING WITHIN RF MODULES |
| 摘要 |
A self-contained coolant loop for semiconductor devices such as high power transistors. The coolant loop includes a microchannel heat sink (32), a micropump (36), and an air-to-liquid heat exchanger (34) incorporated into a replaceable module (30). |
| 申请公布号 |
WO9803997(A1) |
申请公布日期 |
1998.01.29 |
| 申请号 |
WO1997US13326 |
申请日期 |
1997.07.22 |
| 申请人 |
NORTHROP GRUMMAN CORPORATION |
发明人 |
HAMILTON, ROBIN, E.;KENNEDY, PAUL, G. |
| 分类号 |
H01L23/473;(IPC1-7):H01L23/473 |
主分类号 |
H01L23/473 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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