| 摘要 |
PROBLEM TO BE SOLVED: To prevent treatment fluid of a substrate from dripping, while preventing the substrate from drying by adjusting the quantity of treatment fluid held on the substrate to be a specific target value, before the semiconductor substrate is carried between treatment processes. SOLUTION: Before carrying equipements 5A, 5B take out a semiconductor substrate 1 from a spin chuck and carry the substrate, the following is performed; a process wherein cleaning fluid on the semiconductor substrate 1 is eliminated by a physical method, and the quantity of the cleaning fluid held on the substrate is adjusted to be a specific target value. That is, after the supply of the cleaning fluid is stopped and rinsing is halted, the semiconductor substrate 1 is rotated at a number of revolutions lower than that of a cleaning process. Thereby the wet state of the semiconductor substrate 1 can be maintained during the waiting period, until the next cleaning treatment or during carriage, and the quantity of the treatment fluid of the semiconductor substrate 1 can be maintained in a state in which the fluid scarcely drips. |
