| 摘要 |
PURPOSE:To prevent any chip lift in reflow soldering by using BaO, MgO, TiO2, SnO2, La2O3, Pr6O11, Nd2O3, CeO2, Gd2O3, and Dy2O3 wherein each mol ratio is within a specified range. CONSTITUTION:Dielectric porcelain composition is built up in such constitution being expressed in a general formula shown as the Equation I, wherein Re is at least one rare earth element selected from the group consisting of La, Pr, Nd, Sm; wherein Me is at least one rare earth element selected from rare earth elements except La, Pr, Nd, Sm; wherein the values of u, v, and w are within ranges such as 0.01<=u<=0.50, 0.01<=v<=0.20, 0.01<=w<=0.20; and wherein x, y, and z are expressed in mol ratios and x+y+z=1, the values of x, y, z being within the mol ratio range surrounded by a, b, c, d, e, f given in Table I, respectively. |
