发明名称 SIGNAL TERMINATION APPARATUS AND MULTI-LAYER PRINTED CIRCUIT BOARD
摘要 A signal termination apparatus is provided to enable effective signal termination by disposing a signal termination apparatus on a substrate via. One end of a DC(direct current) blocking capacitor component(36) is connected in series to one end of a resistor component(35). The other end of the resistor component is directly connected to a first electrode. The other end of the DC blocking capacitor component is directly connected to a second electrode. One of the first or second electrode comes in contact with a via pad of a via constituting an open stub of a multilayered PCB so as to be electrically connected to the via pad. The first and second electrodes are separated from each other by an interval corresponding to a via pitch of the multilayered PCB.
申请公布号 KR100814375(B1) 申请公布日期 2008.03.18
申请号 KR20070014476 申请日期 2007.02.12
申请人 LEE, SOO HAENG 发明人 LEE, SOO HAENG
分类号 H01L21/60;H01L27/02;H05K3/46 主分类号 H01L21/60
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