Electronic device with chip-on-film package

摘要

An electronic device with COF package is provided. The electronic device includes a flexible substrate, a core circuit unit, multiple output pads, multiple switching elements, and a common test pad. The flexible substrate includes a non-cutting-out area and a cutting-out area. The core circuit unit and output pads are disposed in the non-cutting-out area. First terminals of the switching elements are respectively and electrically connected to output pads of the core circuit unit, and second terminals of the switching elements are respectively and electrically connected to the output pads. The common test pad is disposed in the cutting-out area and electrically connected to the output pads. In a test stage, the switching elements are sequentially turned on such that one of multiple output signals of the core circuit unit is transmitted to the common test pad.

主权项

1. An electronic device with chip-on-film package, comprising:
a flexible substrate at least comprising a non-cutting-out area and a cutting-out area; a core circuit unit disposed in the non-cutting-out area; multiple switching elements comprising a first switching element and a second switching element, wherein a first terminal of the first switching element is electrically connected to a first output terminal of the core circuit unit, and a first terminal of the second switching element is electrically connected to a second output terminal of the core circuit unit; multiple output pads disposed in the non-cutting-out area, wherein the multiple output pads comprise a first output pad and a second output pad, the first output pad is electrically connected to a second terminal of the first switching element, the first output pad is electrically connected to the first output terminal of the core circuit unit through the first switching element when the first switching element is turned on, the second output pad is electrically connected to a second terminal of the second switching element, and the second output pad is electrically connected to the second output terminal of the core circuit unit through the second switching element when the second switching element is turned on; and a common test pad disposed in the cutting-out area, wherein the common test pad is electrically connected to the output pads, the common test pad is electrically connected to the first output terminal of the core circuit unit through the first output pad and the first switching element when the first switching element is turned on, and the common test pad is electrically connected to the second output terminal of the core circuit unit through the second output pad and the second switching element when the second switching element is turned on; wherein, in a test stage, the switching elements are sequentially turned on in different time such that one of multiple output signals of the core circuit unit is transmitted to the common test pad.