| 摘要 |
According to an embodiment, a manufacturing method of a film for a chip-on-film (COF) package capable of maximizing the area on which a signal line can be formed by forming circuit patterns on the both sides of a film for a COF package includes: a step of forming via holes penetrating both surfaces of a base film; a step of forming a sputtering film on the both side and the via holes by performing sputtering on the both sides of the base film; a step of forming a plating film on the both sides and the via holes by performing plating on the both sides of the base film on the both sides of which the sputtering film is formed; and a step of forming a circuit pattern on each of the both sides of the base film, on which the plating film is formed. |
