| 摘要 |
PURPOSE:To easily identify a utility object of wire bonding pads in a wire bonding step by providing the pads having at least two types or more of different flat surface shapes on a semiconductor substrate. CONSTITUTION:Bonding pads 2, 3 having at least two types or more of different flat surface shapes are provided in response to utility on a semiconductor substrate 1. The pad 2 has an object to supply power and a square shape. The pad 3 has an object to output a signal and an octagonal shape. Thus, in a wire bonding step, the objects of the pads can be easily identified, and bonding errors can be reduced. |
