发明名称 |
Clamping heat sinks to circuit boards over processors |
摘要 |
A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor. |
申请公布号 |
HK1059986(A1) |
申请公布日期 |
2007.07.27 |
申请号 |
HK20040102739 |
申请日期 |
2004.04.19 |
申请人 |
INTEL CORPORATION |
发明人 |
BOOKHARDT, GARY, L.;MCEUEN, SHAWN, S. |
分类号 |
H01L;H01L23/40;H05K;H05K3/30 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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