| 摘要 |
PURPOSE:To reduce the generation of signal leakage between each pin in high frequency by laying out at least one bonding pad which does not affect the operation of an oscillation circuit for shield between the bonding pads pulled out from the oscillation circuit. CONSTITUTION:A base of an oscillation transistor 4 is connected with a bonding pad 1 while a collector is connected with a bonding pad 3 and an electrode by way of a resistor 7. A bonding pad 2 connected with GND is laid out so as to inhibit positive feedback. This construction makes it possible to improve the isolation by about 10d compared with a device having no bonding pad. |
