SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To enable wiring resistance to be reduced and a memory cell area to be reduced by placing a conductive film which fixes a source potential of a MOS transistor for drive at a reference potential on an upper part than the MOS transistor after covering an entire surface of the memory cell. CONSTITUTION:MOS transistors for driving an n channel T1 and T2 and MOS transistors T3 and T4 for transferring the n channel are formed within a p-type well 24 which is formed within an n-type silicon substrate 23. A connection hole 14c is opened on a high-concentration n-type impurities region 12c which becomes a common source of the MOS transistors T1 and T2. A second-layer conductive film 15c for fixing a source potential of all MOS transistors for drive within the memory cell is connected to the region 12c through the connection hole 14c, thus enabling a memory cell area to be reduced while reducing resistance of wiring resistor of the conductive film for fixing the source potential to the reference potential.