发明名称 |
Kupferkaschierte Kunststoffplatte und Verfahren zur Herstellung derselben |
摘要 |
Mould lamination of copper foil with a mat or resin bonded continuous glass fibres impregnated with a polymerisable composition where the glass is bound by an unsaturated polyester resin and the impregnation resin is a mixture of methylmethacrylate (pref. polymer dissolved in more monomer) and an unsaturated polyester pref. also containing an epoxide resin. The foil and fibre layers are bonded to form laminates for making printed circuit boards (by selective etchings) featuring a high surface polish and flex resistance. |
申请公布号 |
DE2003982(A1) |
申请公布日期 |
1970.08.06 |
申请号 |
DE19702003982 |
申请日期 |
1970.01.29 |
申请人 |
THE CINCINNATI MILLING MACHINE COMPANY |
发明人 |
JAMES HILTENBEITEL,STANLEY;ULRICH ZOLG,FRED |
分类号 |
B29B15/10;B29C70/38;H05K1/03 |
主分类号 |
B29B15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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