Halbleiterbauelement mit Kunststoffuellung

摘要

The cover of a cup-shaped housing of electrically and thermally conductive material which encloses a semiconductor body in a gas-tight manner is supported in the housing in a manner whereby the surface of the cover farther from the semiconductor body is at least as high as the outer height dimension of the side wall of the housing. This permits good heat conductivity to an assembly part in a recess of which the housing is pressed, without adverse effect on the synthetic material of the cover.